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Packaging Design Example

Electronics Packaging Design and Thermal Analysis

TKG demonstrated our capability in the Electronics Packaging Design Area in a recent Semiconductor Test Head cooling/acoustics design contract:

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The Test Head electrical design and basic packaging approach was chosen before we joined the team. Our task was to map the power dissipation in 3-D, determine the volume and location of cooling air required per circuit module, map the cooling air requirements for the test head in 3-d and then design the air evacuation system. 

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The Test Head consisted of 24 PCBA's with a combined power dissipation of about 4000 watts. The ambient air was specified as 60F to 81F, attitude was Sea Level to 10,000 feet and the maximum cooling air temperature rise through the enclosure was limited to 30F. We met these constraints by specifying a single blower / controller capable of evacuating a minimum of 450 CFM heated air at sea level and a minimum of 675 CFM heated air at 10,000 feet elevation.

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Working with the Client's Mechanical Design Staff Members, we assisted with the incorporation of these other attendant elements into the overall system design, including the Test Head internal plenum design and the flexible air transport duct between the test head and the blower.

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Working with the Client's Design Staff Members, we also assisted with the design in the areas of Regulatory Compliance, Manufacturability, and Electromagnetic Compatibility.

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We provided Failure Analysis and Corrective Action assistance as an adjunct to our assistance during the Debug and Testing of the Prototype Unit.

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Rich Kelley

The Kelley Group

417 Camille Circle Ste. 12

San Jose, CA 95134

408-894-9064

Fax 509-692-1137

rjkelley@sbcglobal.net

 

Call today to set up your free one hour appointment. We'll review your project and if we are not a good match or are not able to meet your schedule, we'll refer you to someone who will be able to assist you.

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