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Packaging Design Example
Electronics Packaging Design and Thermal Analysis
TKG demonstrated our capability in the Electronics Packaging
Design Area in a recent Semiconductor Test Head cooling/acoustics design
contract:
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The Test Head electrical design and basic packaging
approach was chosen before we joined the team. Our task was to map the power
dissipation in 3-D, determine the volume and location of cooling air
required per circuit module, map the cooling air requirements for the test
head in 3-d and then design the air evacuation system. |
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The Test Head consisted of 24 PCBA's with a combined power
dissipation of about 4000 watts. The ambient air was specified as 60F to
81F, attitude was Sea Level to 10,000 feet and the maximum cooling air
temperature rise through the enclosure was limited to 30F. We met these
constraints by specifying a single blower / controller capable of evacuating
a minimum of 450 CFM heated air at sea level and a minimum of 675 CFM heated
air at 10,000 feet elevation. |
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Working with the Client's Mechanical Design Staff Members,
we assisted with the incorporation of these other attendant elements into
the overall system design, including the Test Head internal plenum design
and the flexible air transport duct between the test head and the blower. |
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Working with the Client's Design Staff Members, we also
assisted with the design in the areas of Regulatory Compliance,
Manufacturability, and Electromagnetic Compatibility. |
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We provided Failure Analysis and Corrective Action
assistance as an adjunct to our assistance during the Debug and Testing of
the Prototype Unit. |

Rich Kelley
The Kelley Group
417 Camille Circle
Ste. 12
San Jose, CA 95134
408-894-9064
Fax 509-692-1137
rjkelley@sbcglobal.net
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Call today to set up your free one hour appointment.
We'll review your project and if we are not a good match or are not
able to meet your schedule, we'll refer you to someone who will be
able to assist you. |
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